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ĮVENT# Pin The temperature sensor also adds the EVENT# pin (open-drain).
#Mt18jsf51272az pc3 12800e serial
Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module's temperature and can be read back at any time over the I Serial Presence-Detect For the latest SPD data, refer to Micron's SPD page: Table 13. Table 12: DDR3 I Specifications and Conditions – 4GB DD Values are for the MT41J256M8 DDR3 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) component data sheet Parameter Operating current 0: One bank. I Specifications DD Table 11: DDR3 I Specifications and Conditions – 2GB DD Values are for the MT41J128M8 DDR3 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) component data sheet Parameter Operating current. Micron encourages designers to simulate the signal characteristics of the system's mem- ory bus to ensure adequate signal integrity of the entire memory system. However, good signal integrity starts at the system level. Design Considerations Simulations Micron memory modules are designed to optimize signal integrity through carefully de- signed terminations, controlled board impedances, routing topologies, trace length matching, and decoupling. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device's data. Įlectrical Specifications Stresses greater than those listed may cause permanent damage to the module. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins.
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įunctional Block Diagram Figure 2: Functional Block Diagram S1# S0# DQS0 DQS0# DM0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 V DQS1 DQS1# DM1 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 V DQS2 DQS2# DM2 DQ16 DQ17 DQ18. Table 7: Component-to-Module DQ Map (Continued) Component Reference Component Number DQ Module DQ U12 U14 U16.
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ĭQ Map Table 7: Component-to-Module DQ Map Component Reference Component Number DQ Module. Table 6: Pin Descriptions (Continued) Symbol Type SDA I/O TDQSx, Output TDQSx# Err_Out# Output (open drain) EVENT# Output (open drain) V Supply DD V Supply DDSPD V Supply REFCA V Supply REFDQ V Supply SS V Supply TT – NC. Table 6: Pin Descriptions Symbol Type Ax Input BAx Input. See Pin Assignments for information specific to this module. All pins listed may not be supported on this module.
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Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR3 modules. Pin Assignments Table 5: Pin Assignments 240-Pin DDR3 UDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin DQ25 61 REFDQ DQ0 33 DQS3 DQ1 34 DQS3 64. The data sheet for the base device can be found on Micron’. 240-pin, unbuffered dual in-line memory module (UDIMM).DDR3 functionality and operations supported as defined in the component data sheet.DDR3 SDRAM UDIMM MT18JSF25672AZ – 2GB MT18JSF51272AZ – 4GB Features